4. Abstract Submission Method: Participating representatives are requested to submit their abstracts on the conference website according to the respective forum themes. The deadline for abstract submission is June 12, 2026.
A. Thermal Management for Chips and Devices
B. Microscale Thermal Characterization and Measurement
C. Thermoelectric Energy Conversion
D. Interfacial Thermal Conduction
E. Heat Conduction and Machine Learning
F. Thermal Management for Batteries
G. Non-Conductive Heat Transport (Convection, Radiation, etc.)
H. Phononic New Physics (coherence, chirality, targeted etc.)
I. Heat Conduction and Quantum Thermodynamics in Low-Dimensional Systems
J. Thermal and Electrical Transport in Organic Systems
K. Non-Equilibrium Thermal Transport/ Thermophysical Properties under Extreme Conditions
L. Thermal functional Materials (conductive, phase change, etc.)
M. Interactions between phonon and other energy carriers
N.Aerospace thermal management technology and cross-domain innovation
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